Axial Leaded Glass Encapsulated Diode DO35 Shape NTC Thermistor Temperature Sensor, 100K Ohm, Beta B(25/50): 3950K, Operating Temperature Range -40C to +250C.

AMWEI Product Code: AMF58-104G3950

Appearance Dimension 

Axial Glass NTC Thermistor Temperature Sensor Dimension

Unit: mm

  • NTC Thermistor chip hermetically sealed in DO35 glass shell.
  • Tinned Dumet wire

Axial Glass NTC Thermistor Application

Axial lead glass encapsulated NTC thermistor used for high temperature measurement, sensing, monitoring, detection and control. Typical application such as  industrial process control, HVAC, oven,  office equipment, etc.

AMWEI Axial Glass Encapsulated NTC Thermistor Electric Characteristics Data

  • Resistance at 25C R25: 100K ohm+/-2%
  • Beta Value B(25/50): 3950K+/-1%
  • Optional R25 resistance tolerance,  ±1%(F), ±2%(G), ±3%(H), or ±5%(J)
  • Dissipation Factor:  δ≥2mW/℃
  • Thermal Time Constant (in still air): 12 seconds max.
  • Rated Power: ≤50mW
  • Insulation resistance: room temperature, 50VDC, 60 Seconds, ≥100MΩ.
  • Operating temperature range: -40 to +250C.

NTC 100K Ohm 3950K Resistance vs. Temperature RT Data

(K Ohm)
(K Ohm )
(K Ohm)
-40C 3306.340 KΩ 80C 12.493 KΩ 200C 0.575 KΩ
-35C 2371.292 KΩ 85C 10.627 KΩ 205C 0.522 KΩ
-30C 1724.210 KΩ 90C 9.071 KΩ 210C 0.474 KΩ
-25C 1269.970 KΩ 95C 7.768 KΩ 215C 0.431 KΩ
-20C 946.609 KΩ 100C 6.674 KΩ 220C 0.392 KΩ
-15C 713.327 KΩ 105C 5.752 KΩ 225C 0.358 KΩ
-10C 542.919 KΩ 110C 4.973 KΩ 230C 0.327 KΩ
-5C 416.996 KΩ 115C 4.311 KΩ 235C 0.299 KΩ
0C 322.959KΩ 120C 3.748 KΩ 240C 0.274 KΩ
5C 252.055 KΩ 125C 3.268 KΩ 245C 0.252 KΩ
10C 198.122 KΩ 130C 2.857 KΩ 250C 0.231 KΩ
15C 156.771 KΩ 135C 2.504 KΩ
20C 124.833 KΩ 140C 2.200 KΩ
25C 100.000 KΩ 145C 1.938 KΩ
30C 80.572KΩ 150C 1.711 KΩ
35C 65.284 KΩ 155C 1.520 KΩ
40C 53.188 KΩ 160C 1.353 KΩ
45C 43.569 KΩ 165C 1.207 KΩ
50C 35.882 KΩ 170C 1.079 KΩ
55C 29.759 KΩ 175C 0.967 KΩ
60C 24.802 KΩ 180C 0.868 KΩ
65C 20.766 KΩ 185C 0.781 KΩ
70C 17.461 KΩ 190C 0.704 KΩ
75C 14.741 KΩ 195C 0.636 KΩ

Axial Leaded Glass Encapsulated NTC Thermistor Mechanical Test

Test Standard Test Conditions and methods Requirements
Soldering & Solderability IEC60068-2-20
Test Ta
Temperature: 230±5 ℃,
2-2.5mm away from ceramic body
On: 2±0.5 Seconds.
The terminations shall be evenly tinned
Resistant to soldering heat IEC60068-2-20
Test Tb
Temperature: 260±5℃,
2-2.5mm away from ceramic body
On:10±1 Seconds.
No visible damage,
Lead wire tensile IEC60068-2-21
Test U
Test Ua: Force 10N, On 10 Seconds;
Test Ub: Bending 90C, Force 5N, Twice.
No break off,

Axial Leaded Glass Encapsulated NTC Thermistor Reliability Data

Test Standard Test Conditions ΔR25/R25 (typical) Remarks
Low temperature storage IEC 60068-2-1 Storage at low category
temperature: -30 oC,
Time: 1000 hours
≤3% No visible damage
Storage in dry heat IEC 60068-2-2 Storage at upper category temperature: 200 oC,
Time: 1000 hours
≤3% No visible damage
Storage in damp heat, steady state (Humidity test) IEC 60068-2-3 Temperature: 40oC,
Humidity:90%-95% RH,
Duration:1000 hours
≤3% No visible damage
Temperature cycling IEC 60068-2-14 1. -30C/30 minutes
2. 80C/5 minutes
3. 200C/30 minutes
4. 80C/5 minutes.
Number of cycles: 5 Cycles
≤3% No visible damage

Axial Lead Glass Sealed NTC Thermistor Application Precaution

Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.

Mounting and Handling Recommendations

Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:

  • No perpendicular forces must be applied to the body
  • During bending, the leads must be supported
  • Bending close to the body must be done very carefully
  • Axial forces to the body can influence the accuracy of the sensor and should be avoided
  • These sensors can be mounted on a minimum pitch of >5 mm

Soldering and Welding

  • Avoid any force on the body or leads during, or just after, soldering.
  • Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
  • Prevent fast cooling after soldering.
  • For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
  • For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
  • soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
  • The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor. 

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