Axial Leaded Glass Encapsulated Diode DO35 Shape NTC Thermistor Temperature Sensor, 100K Ohm, Beta B(25/50): 3990K, Operating Temperature Range -40C to +250C.

AMWEI Product Code: AMF58-104G3990

Appearance Dimension 

Axial Glass NTC Thermistor Temperature Sensor Dimension

Unit: mm

  • NTC Thermistor chip hermetically sealed in DO35 glass shell.
  • Tinned Dumet wire

Axial Glass NTC Thermistor Application

Axial lead glass encapsulated NTC thermistor used for high temperature measurement, sensing, monitoring, detection and control. Typical application such as  industrial process control, HVAC, oven,  office equipment, etc.

AMWEI Axial Glass Encapsulated NTC Thermistor Electric Characteristics Data

  • Resistance at 25C R25: 100K ohm+/-2%
  • Beta Value B(25/50): 3990K+/-1%
  • Optional R25 resistance tolerance,  ±1%(F), ±2%(G), ±3%(H), or ±5%(J)
  • Dissipation Factor:  δ≥2mW/℃
  • Thermal Time Constant (in still air): 12 seconds max.
  • Rated Power: ≤50mW
  • Insulation resistance: room temperature, 50VDC, 60 Seconds, ≥100MΩ.
  • Operating temperature range: -40 to +250C.

NTC 100K Ohm 3990K Resistance vs. Temperature RT Data

(K Ohm)
(K Ohm )
(K Ohm)
-40C 3346.560 KΩ 80C 12.129 KΩ 200C 0.541 KΩ
-35C 2396.692 KΩ 85C 10.272 KΩ 205C 0.491 KΩ
-30C 1740.210 KΩ 90C 8.730 KΩ 210C 0.445 KΩ
-25C 1280.009 KΩ 95C 7.444 KΩ 215C 0.405 KΩ
-20C 952.886 KΩ 100C 6.369 KΩ 220C 0.369 KΩ
-15C 717.250 KΩ 105C 5.468 KΩ 225C 0.336 KΩ
-10C 545.378 KΩ 110C 4.710 KΩ 230C 0.307 KΩ
-5C 418.549 KΩ 115C 4.071 KΩ 235C 0.281 KΩ
0C 323.948 KΩ 120C 3.531 KΩ 240C 0.257 KΩ
5C 252.686 KΩ 125C 3.073 KΩ 245C 0.236 KΩ
10C 198.518 KΩ 130C 2.684 KΩ 250C 0.217 KΩ
15C 157.000 KΩ 135C 2.352 KΩ
20C 124.936 KΩ 140C 2.068 KΩ
25C 100.000 KΩ 145C 1.825 KΩ
30C 80.482KΩ 150C 1.616 KΩ
35C 65.113 KΩ 155C 1.435 KΩ
40C 52.944 KΩ 160C 1.277 KΩ
45C 43.259 KΩ 165C 1.139 KΩ
50C 35.511 KΩ 170C 1.018 KΩ
55C 29.388 KΩ 175C 0.912 KΩ
60C 24.429 KΩ 180C 0.818 KΩ
65C 20.391 KΩ 185C 0.736 KΩ
70C 17.087 KΩ 190C 0.663 KΩ
75C 14.370 KΩ 195C 0.599 KΩ

Axial Leaded Glass Encapsulated NTC Thermistor Mechanical Test

Test Standard Test Conditions and methods Requirements
Soldering & Solderability IEC60068-2-20
Test Ta
Temperature: 230±5 ℃,
2-2.5mm away from ceramic body
On: 2±0.5 Seconds.
The terminations shall be evenly tinned
Resistant to soldering heat IEC60068-2-20
Test Tb
Temperature: 260±5℃,
2-2.5mm away from ceramic body
On:10±1 Seconds.
No visible damage,
Lead wire tensile IEC60068-2-21
Test U
Test Ua: Force 10N, On 10 Seconds;
Test Ub: Bending 90C, Force 5N, Twice.
No break off,

Axial Leaded Glass Encapsulated NTC Thermistor Reliability Data

Test Standard Test Conditions ΔR25/R25 (typical) Remarks
Low temperature storage IEC 60068-2-1 Storage at low category
temperature: -30 oC,
Time: 1000 hours
≤3% No visible damage
Storage in dry heat IEC 60068-2-2 Storage at upper category temperature: 200 oC,
Time: 1000 hours
≤3% No visible damage
Storage in damp heat, steady state (Humidity test) IEC 60068-2-3 Temperature: 40oC,
Humidity:90%-95% RH,
Duration:1000 hours
≤3% No visible damage
Temperature cycling IEC 60068-2-14 1. -30C/30 minutes
2. 80C/5 minutes
3. 200C/30 minutes
4. 80C/5 minutes.
Number of cycles: 5 Cycles
≤3% No visible damage

Axial Lead Glass Sealed NTC Thermistor Application Precaution

Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.

Mounting and Handling Recommendations

Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:

  • No perpendicular forces must be applied to the body
  • During bending, the leads must be supported
  • Bending close to the body must be done very carefully
  • Axial forces to the body can influence the accuracy of the sensor and should be avoided
  • These sensors can be mounted on a minimum pitch of >5 mm

Soldering and Welding

  • Avoid any force on the body or leads during, or just after, soldering.
  • Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
  • Prevent fast cooling after soldering.
  • For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
  • For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
  • soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
  • The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor. 

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