Axial Leaded Glass Encapsulated Diode DO35 Shape NTC Thermistor Temperature Sensor, 30K Ohm, Beta B(25/50): 3950K, Operating Temperature Range -40C to +250C.

AMWEI Product Code: AMF58-303G3950

Appearance Dimension 

Axial Glass NTC Thermistor Temperature Sensor Dimension

Unit: mm

  • NTC Thermistor chip hermetically sealed in DO35 glass shell.
  • Tinned Dumet wire

Axial Glass NTC Thermistor Application

Axial lead glass encapsulated NTC thermistor used for high temperature measurement, sensing, monitoring, detection and control. Typical application such as  industrial process control, HVAC, oven,  office equipment, etc.

AMWEI Axial Glass Encapsulated NTC Thermistor Electric Characteristics Data

  • Resistance at 25C R25: 30K ohm+/-2%
  • Beta Value B(25/50): 3950K+/-1%
  • Optional R25 resistance tolerance,  ±1%(F), ±2%(G), ±3%(H), or ±5%(J)
  • Dissipation Factor:  δ≥2mW/℃
  • Thermal Time Constant (in still air): 12 seconds max.
  • Rated Power: ≤50mW
  • Insulation resistance: room temperature, 50VDC, 60 Seconds, ≥100MΩ.
  • Operating temperature range: -40 to +250C.

NTC 30K Ohm 3950K Resistance vs. Temperature RT Data

(K Ohm)
(K Ohm )
(K Ohm)
-40C 959.724 KΩ 80C 3.735 KΩ 200C 0.183 KΩ
-35C 691.335 KΩ 85C 3.178 KΩ 205C 0.166 KΩ
-30C 504.740 KΩ 90C 2.714 KΩ 210C 0.151 KΩ
-25C 373.230 KΩ 95C 2.326 KΩ 215C 0.138 KΩ
-20C 279.278 KΩ 100C 1.999 KΩ 220C 0.126 KΩ
-15C 211.269 KΩ 105C 1.724 KΩ 225C 0.115 KΩ
-10C 161.417 KΩ 110C 1.492 KΩ 230C 0.106 KΩ
-5C 124.437 KΩ 115C 1.295 KΩ 235C 0.097 KΩ
0C 96.700 KΩ 120C 1.128 KΩ 240C 0.089 KΩ
5C 75.704 KΩ 125C 0.986 KΩ 245C 0.082 KΩ
10C 59.559 KΩ 130C 0.864 KΩ 250C 0.076 KΩ
15C 47.112 KΩ 135C 0.760 KΩ
20C 37.483 KΩ 140C 0.671 KΩ
25C 30.000 KΩ 145C 0.593 KΩ
30C 24.156KΩ 150C 0.526 KΩ
35C 19.566 KΩ 155C 0.468 KΩ
40C 15.942 KΩ 160C 0.418 KΩ
45C 13.064 KΩ 165C 0.373 KΩ
50C 10.765 KΩ 170C 0.335 KΩ
55C 8.917 KΩ 175C 0.301 KΩ
60C 7.424 KΩ 180C 0.271 KΩ
65C 6.211 KΩ 185C 0.245 KΩ
70C 5.220 KΩ 190C 0.221 KΩ
75C 4.406 KΩ 195C 0.201 KΩ

Axial Leaded Glass Encapsulated NTC Thermistor Mechanical Test

Test Standard Test Conditions and methods Requirements
Soldering & Solderability IEC60068-2-20
Test Ta
Temperature: 230±5 ℃,
2-2.5mm away from ceramic body
On: 2±0.5 Seconds.
The terminations shall be evenly tinned
Resistant to soldering heat IEC60068-2-20
Test Tb
Temperature: 260±5℃,
2-2.5mm away from ceramic body
On:10±1 Seconds.
No visible damage,
Lead wire tensile IEC60068-2-21
Test U
Test Ua: Force 10N, On 10 Seconds;
Test Ub: Bending 90C, Force 5N, Twice.
No break off,

Axial Leaded Glass Encapsulated NTC Thermistor Reliability Data

Test Standard Test Conditions ΔR25/R25 (typical) Remarks
Low temperature storage IEC 60068-2-1 Storage at low category
temperature: -30 oC,
Time: 1000 hours
≤3% No visible damage
Storage in dry heat IEC 60068-2-2 Storage at upper category temperature: 200 oC,
Time: 1000 hours
≤3% No visible damage
Storage in damp heat, steady state (Humidity test) IEC 60068-2-3 Temperature: 40oC,
Humidity:90%-95% RH,
Duration:1000 hours
≤3% No visible damage
Temperature cycling IEC 60068-2-14 1. -30C/30 minutes
2. 80C/5 minutes
3. 200C/30 minutes
4. 80C/5 minutes.
Number of cycles: 5 Cycles
≤3% No visible damage

Axial Lead Glass Sealed NTC Thermistor Application Precaution

Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.

Mounting and Handling Recommendations

Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:

  • No perpendicular forces must be applied to the body
  • During bending, the leads must be supported
  • Bending close to the body must be done very carefully
  • Axial forces to the body can influence the accuracy of the sensor and should be avoided
  • These sensors can be mounted on a minimum pitch of >5 mm

Soldering and Welding

  • Avoid any force on the body or leads during, or just after, soldering.
  • Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
  • Prevent fast cooling after soldering.
  • For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
  • For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
  • soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
  • The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor. 

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