Axial Leaded Glass Encapsulated Diode DO35 Shape NTC Thermistor Temperature Sensor, 5K Ohm, Beta B(25/50): 3470K, Operating Temperature Range -40C to +250C.

AMWEI Product Code: AMF58-502G3470

Appearance Dimension 

Axial Glass NTC Thermistor Temperature Sensor Dimension

Unit: mm

  • NTC Thermistor chip hermetically sealed in DO35 glass shell.
  • Tinned Dumet wire

Axial Glass NTC Thermistor Application

Axial lead glass encapsulated NTC thermistor used for high temperature measurement, sensing, monitoring, detection and control. Typical application such as  industrial process control, HVAC, oven,  office equipment, etc.

AMWEI Axial Glass Encapsulated NTC Thermistor Electric Characteristics Data

  • Resistance at 25C R25: 5K ohm+/-2%
  • Beta Value B(25/50): 3470K+/-1%
  • Optional R25 resistance tolerance,  ±1%(F), ±2%(G), ±3%(H), or ±5%(J)
  • Dissipation Factor:  δ≥2mW/℃
  • Thermal Time Constant (in still air): 12 seconds max.
  • Rated Power: ≤50mW
  • Insulation resistance: room temperature, 50VDC, 60 Seconds, ≥100MΩ.
  • Operating temperature range: -40 to +250C.

NTC 5K Ohm 3470K Resistance vs. Temperature RT Data

(K Ohm)
(K Ohm )
(K Ohm)
-40C 84.397 KΩ 80C 0.798 KΩ 200C 0.056 KΩ
-35C 64.912 KΩ 85C 0.692 KΩ 205C 0.051 KΩ
-30C 50.261 KΩ 90C 0.602 KΩ 210C 0.047KΩ
-25C 39.353 KΩ 95C 0.525 KΩ 215C 0.044 KΩ
-20C 31.183 KΩ 100C 0.459 KΩ 220C 0.040 KΩ
-15C 24.976 KΩ 105C 0.403 KΩ 225C 0.037 KΩ
-10C 20.179 KΩ 110C 0.354 KΩ 230C 0.035 KΩ
-5C 16.408 KΩ 115C 0.313 KΩ 235C 0.032 KΩ
0C 13.399 KΩ 120C 0.277 KΩ 240C 0.030 KΩ
5C 10.971 KΩ 125C 0.246 KΩ 245C 0.028 KΩ
10C 8.998 KΩ 130C 0.219 KΩ 250C 0.026 KΩ
15C 7.388 KΩ 135C 0.195 KΩ
20C 6.073 KΩ 140C 0.174 KΩ
25C 5.000 KΩ 145C 0.156 KΩ
30C 4.128 KΩ 150C 0.141 KΩ
35C 3.422 KΩ 155C 0.127 KΩ
40C 2.853 KΩ 160C 0.115 KΩ
45C 2.396 KΩ 165C 0.105 KΩ
50C 2.032 KΩ 170C 0.095 KΩ
55C 1.722 KΩ 175C 0.087 KΩ
60C 1.466 KΩ 180C 0.079 KΩ
65C 1.252 KΩ 185C 0.072 KΩ
70C 1.074 KΩ 190C 0.066 KΩ
75C 0.925 KΩ 195C 0.061 KΩ

Axial Leaded Glass Encapsulated NTC Thermistor Mechanical Test

Test Standard Test Conditions and methods Requirements
Soldering & Solderability IEC60068-2-20
Test Ta
Temperature: 230±5 ℃,
2-2.5mm away from ceramic body
On: 2±0.5 Seconds.
The terminations shall be evenly tinned
Resistant to soldering heat IEC60068-2-20
Test Tb
Temperature: 260±5℃,
2-2.5mm away from ceramic body
On:10±1 Seconds.
No visible damage,
Lead wire tensile IEC60068-2-21
Test U
Test Ua: Force 10N, On 10 Seconds;
Test Ub: Bending 90C, Force 5N, Twice.
No break off,

Axial Leaded Glass Encapsulated NTC Thermistor Reliability Data

Test Standard Test Conditions ΔR25/R25 (typical) Remarks
Low temperature storage IEC 60068-2-1 Storage at low category
temperature: -30 oC,
Time: 1000 hours
≤3% No visible damage
Storage in dry heat IEC 60068-2-2 Storage at upper category temperature: 200 oC,
Time: 1000 hours
≤3% No visible damage
Storage in damp heat, steady state (Humidity test) IEC 60068-2-3 Temperature: 40oC,
Humidity:90%-95% RH,
Duration:1000 hours
≤3% No visible damage
Temperature cycling IEC 60068-2-14 1. -30C/30 minutes
2. 80C/5 minutes
3. 200C/30 minutes
4. 80C/5 minutes.
Number of cycles: 5 Cycles
≤3% No visible damage

Axial Lead Glass Sealed NTC Thermistor Application Precaution

Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.

Mounting and Handling Recommendations

Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:

  • No perpendicular forces must be applied to the body
  • During bending, the leads must be supported
  • Bending close to the body must be done very carefully
  • Axial forces to the body can influence the accuracy of the sensor and should be avoided
  • These sensors can be mounted on a minimum pitch of >5 mm

Soldering and Welding

  • Avoid any force on the body or leads during, or just after, soldering.
  • Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
  • Prevent fast cooling after soldering.
  • For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
  • For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
  • soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
  • The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor. 

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