Axial Leaded Glass Encapsulated  NTC Thermistors Temperature Sensor

Axial Glass NTC Thermistor

Axial Glass NTC Thermistor

AMF58 series NTC thermistor in glass encapsulated package, diode DO35 outline, with axial tinned Dumet ( Copper-Clad Ni-Fe) wire. Widely applied in temperature measurement, detection, indicator, monitoring, gauging, control, calibration and compensation, etc.

Axial Glass NTC Thermistor Features

  • Glass body DO35 package provides hermetic seal & voltage insulation, can operate in high temperature and moisture environment.
  • Small dimension, solid, convenient for automatic installation.
  • Fast heat induction, high sensitivity.
  • Operating temperature -45C to +250C.
  • Nominal resistance @25C can be from 2kΩ— 1.388 million ohm.
  • Typical resistance at 25C 2k ohm, 5k ohm, 10k ohm, 20k ohm, 47k ohm, 50k ohm, 100k ohm, 200k ohm, 500k ohm, 1.388 million ohm etc.
  • Tight tolerance on resistance and beta value.
  • Dissipation factor: ≥2.0 mW/C in still air.
  • Thermal time constant: ≤12 seconds in still air.

Axial Glass NTC Thermistor Application Examples:

In household electronics temperature measurement, detection and control: such as air-conditioners, micro-wave ovens, electric fans, and electric heaters, electric cookers, induction cooker, hair driers, etc.

Temperature detection and compensation of automatic office equipment, such as copiers and printers.

In heating and air conditioning (HVAC): in heating cost distributors, for room temperature monitoring, in under-flooring heating and gas boilers, for determining exhaust gas or burner temperature, outdoor temperature sensor.

Industrial electronics: for temperature stabilization of laser diodes and photo-elements, for temperature compensation in copper coils or reference point compensation of thermo-elements, etc. Also for temperature measurement and compensation of meters, instruments, integrated circuits, quartz crystal oscillators and thermocouples.

In telecommunication: for temperature measurement, compensation and control and protection of mobile phones, battery pack and battery charger, etc.

Glass encapsulated package NTC thermistor can also be used in temperature measurement, monitoring, detection and control of medical equipment, food processing equipment, climate, etc.

Axial Leaded Glass Encapsulated NTC Thermistor Dimension

Unit: mm

AMWEI Axial Glass Encapsulated NTC Thermistor Data Sheet

Part numberResistance
@25C
R25 (K ohm)
Beta value
(K)
Specific Temperature
Point Resistance
Data (ohm)
AMF58-202□3839(B5/25)R25:2K ohmB(5/25C):3839KR5: 5.06K ohm
AMF58-502□3470R25:5K ohmB(25/50C):3470K
AMF58-502□3950R25:5K ohmB(25/50C):3950K
AMF58-103□3380R25:10K ohmB(25/50C):3380K
AMF58-103□3435(B25/85)R25:10K ohmB(25/85C):3435K
AMF58-103□3470R25:10K ohmB(25/50C):3470K
AMF58-103□3600R25:10K ohmB(25/50C):3600K
AMF58-103□3700R25:10K ohmB(25/50C):3700K
AMF58-103□3950R25:10K ohmB(25/50C):3950K
AMF58-103□3975(B25/85)R25:10K ohmB(25/85C):3975K
AMF58-103□4100R25:10K ohmB(25/50C):4100K
AMF58-203□3950R25:20K ohmB(25/50C):3950K
AMF58-233□4200R25:23K ohmB(25/50C):4200K
AMF58-303□3950R25:30K ohmB(25/50C):3950K
AMF58-40.27K□3979(B25/85)R25:40.27K ohmB(25/85C):3979K
AMF58-473□3950R25:47k ohmB(25/50C):3950K
AMF58-503□3950R25:50K ohmB(25/50C):3950K
AMF58-503□4050R25:50K ohmB(25/50C):4050K
AMF58-98.75K□4300(B100/200)R25:98.75KΩB(100/200C):4300KR200: 0.55K ohm
AMF58-104□3899R25:100K ohmB(25/50C):3899K
AMF58-104□3930R25:100K ohmB(25/50C):3930K
AMF58-104□3950R25:100K ohmB(25/50C):3950K
AMF58-104□3990R25:100K ohmB(25/50C):3990K
AMF58-104□4200R25:100K ohmB(25/50C):4200K
AMF58-204□3899R25:200K ohmB(25/50C):3899KR160:3.0K ohm
AMF58-204□4200R25:200K ohmB(25/50C):4200K
AMF58-204□4260R25:200K ohmB(25/50C):4260K
AMF58-504□4050R25:500K ohmB(25/50C):4050K
AMF58-504□4260R25:500K ohmB(25/50C):4260K
AMF58-1.388M□4500R25:1388K ohmB(25/50C):4500KR200:4.0K ohm

Notes:□ in the part number for filling in resistance tolerance, optional for ±1%(F), ±2%(G), ±3%(H), or ±5%(J).

Axial Leaded Glass Encapsulated NTC Thermistor Reliability Data

Test
Standard
Test Conditions
ΔR25/R25 (typical)
Remarks
Low temperature storageIEC 60068-2-1Storage at low category temperature: -30 oC, Time: 1000 hours
≤2%
No visible damage
Storage in dry heatIEC 60068-2-2Storage at upper category temperature: 200 oC, Time: 1000 hours
≤2%
No visible damage
Storage in damp heat, steady state (Humidity test)IEC 60068-2-3Temperature: 40oC,
Humidity:90%-95% RH,
Duration:1000 hours
≤2%
No visible damage
Temperature cyclingIEC 60068-2-141. -30C/30 minutes
2. 80C/5 minutes
3. 200C/30 minutes
4. 80C/5 minutes.
Number of cycles: 5 Cycles
≤2%
No visible damage

Axial Leaded Glass Encapsulated NTC Thermistor Mechanical Test

Test
Standard
Test Conditions and methods
Requirements
Soldering & SolderabilityIEC60068-2-20
Test Ta
Temperature: 230±5 ℃,
2-2.5mm away from ceramic body,On: 2±0.5 Seconds.
The terminations shall be evenly tinned
Resistant to soldering heatIEC60068-2-20
Test Tb
Temperature: 260±5℃,
2-2.5mm away from ceramic body,On:10±1 Seconds.
No visible damage,
ΔR25/R25 ≤ 2%
Lead wire tensileIEC60068-2-21
Test U
Test Ua: Force 10N, On 10S;
Test Ub: Bending 90C, Force 5N, Twice.
No break off,
ΔR25/R25 ≤ 2%

Axial Glass NTC Thermistor Application Precaution

Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.

Mounting and Handling Recommendations

Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:

  • No perpendicular forces must be applied to the body
  • During bending, the leads must be supported
  • Bending close to the body must be done very carefully
  • Axial forces to the body can influence the accuracy of the sensor and should be avoided
  • These sensors can be mounted on a minimum pitch of >5 mm

Soldering and Welding

  • Avoid any force on the body or leads during, or just after, soldering.
  • Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
  • Prevent fast cooling after soldering.
  • For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
  • For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
  • soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
  • The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor. 

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