Silicon PTC Thermistor Temperature Sensor, Axial Leaded Glass Sealed DO35 Package, Resistance @100C 1000Ω +/-3%, Operating Temperature -40C–+180C, Cross to NXP KTY84-130 Silistor.
Unit: mm
- Silicon chip hermetically sealed in DO35 glass shell.
- Tinned Dumet wire
Silicon Temp Sensor 100C 1K KTY84-130 RT Curve Temperature (Centigrade C)
- High accuracy and reliability
- Long-term stability
- Positive temperature coefficient;
fail-safe behavior - Virtually linear characteristics
- Motion control temperature sensor, temperature sensing and controls in drives and motors, spindles, inverters and control systems, etc.
- Industrial automation control equipment.
- Precision circuit and crystal oscillator temperature compensation.
- Temperature compensation of silicon semiconducting devices.
- Temperature compensation of instrumentation amplifier.
- A/D converter temperature compensation.
- Micro motor timing control.
- Automobile temperature detection and control.
- Medical equipment temperature detection and control.
- Linear PTC thermistors applications also include transmission, engine oil and coolant, heating system, overheating protection, amplifiers, power supplies, transducers, telemetry, computers, magnetic amplifiers, thermometry, meteorology, temperature regulation and over-temperature protection.
Resistance at 100C: 970–1030Ω
Dissipation Factor：1.5mW/C min. in still air
Thermal Time Constant： 21 seconds max. in still air
Insulation Resistance： 100MΩ (DC=100V)
Maximum operating current： 8mA max.
Rated operating current 2mA
Rated Power： 50mW max.
Temperature measurement range: -55C~+180C
Storage time 2 Years (Room temperature, relative humidity <60%)
| Ambient Temperature | Temperature Coefficient (%/K) |
Resistance ( Ohm) |
|
|---|---|---|---|
| Centigrade (°C) |
Fahrenheit (°F) |
||
| -40 | -40 | 0.84 | 359 |
| -30 | -22 | 0.83 | 391 |
| -20 | -4 | 0.82 | 424 |
| -10 | 14 | 0.80 | 460 |
| 0 | 32 | 0.79 | 498 |
| 10 | 50 | 0.77 | 538 |
| 20 | 68 | 0.75 | 581 |
| 25 | 77 | 0.74 | 603 |
| 30 | 86 | 0.73 | 626 |
| 40 | 104 | 0.71 | 672 |
| 50 | 122 | 0.70 | 722 |
| 60 | 140 | 0.68 | 773 |
| 70 | 158 | 0.66 | 826 |
| 80 | 176 | 0.64 | 882 |
| 90 | 194 | 0.63 | 940 |
| 100 | 212 | 0.61 | 1000 |
| 110 | 230 | 0.60 | 1062 |
| 120 | 248 | 0.58 | 1127 |
| 130 | 266 | 0.57 | 1194 |
| 140 | 284 | 0.55 | 1262 |
| 150 | 302 | 0.54 | 1334 |
| 160 | 320 | 0.53 | 1407 |
| 170 | 338 | 0.52 | 1482 |
| 180 | 356 | 0.51 | 1560 |
Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.
Mounting and Handling Recommendations
Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:
- No perpendicular forces must be applied to the body
- During bending, the leads must be supported
- Bending close to the body must be done very carefully
- Axial forces to the body can influence the accuracy of the sensor and should be avoided
- These sensors can be mounted on a minimum pitch of >5 mm
Soldering and Welding
- Avoid any force on the body or leads during, or just after, soldering.
- Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
- Prevent fast cooling after soldering.
- For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
- For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
- soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
- The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor.
