Axial Leaded Glass Encapsulated Diode DO35 Shape NTC Thermistor Temperature Sensor, 100K Ohm, Beta B(25/50): 4200K, Operating Temperature Range -40C to +250C.

AMWEI Product Code: AMF58-104G4200

Appearance Dimension 

Axial Glass NTC Thermistor Temperature Sensor Dimension

Unit: mm

  • NTC Thermistor chip hermetically sealed in DO35 glass shell.
  • Tinned Dumet wire

Axial Glass NTC Thermistor Application

Axial lead glass encapsulated NTC thermistor used for high temperature measurement, sensing, monitoring, detection and control. Typical application such as  industrial process control, HVAC, oven,  office equipment, etc.

AMWEI Axial Glass Encapsulated NTC Thermistor Electric Characteristics Data

  • Resistance at 25C R25: 100K ohm+/-2%
  • Beta Value B(25/50): 4200K+/-1%
  • Optional R25 resistance tolerance,  ±1%(F), ±2%(G), ±3%(H), or ±5%(J)
  • Dissipation Factor:  δ≥2mW/℃
  • Thermal Time Constant (in still air): 12 seconds max.
  • Rated Power: ≤50mW
  • Insulation resistance: room temperature, 50VDC, 60 Seconds, ≥100MΩ.
  • Operating temperature range: -40 to +250C.

NTC 100K Ohm 4200K Resistance vs. Temperature RT Data

(K Ohm)
(K Ohm )
(K Ohm)
-40C 4124.951 KΩ 80C 10.991 KΩ 200C 0.453 KΩ
-35C 2890.803 KΩ 85C 9.271 KΩ 205C 0.410 KΩ
-30C 2053.500 KΩ 90C 7.850 KΩ 210C 0.371 KΩ
-25C 1479.195 KΩ 95C 6.671 KΩ 215C 0.337 KΩ
-20C 1080.200 KΩ 100C 5.688 KΩ 220C 0.306 KΩ
-15C 799.157 KΩ 105C 4.865 KΩ 225C 0.279 KΩ
-10C 598.392 KΩ 110C 4.177 KΩ 230C 0.255 KΩ
-5C 452.969 KΩ 115C 3.599 KΩ 235C 0.233 KΩ
0C 346.214 KΩ 120C 3.112 KΩ 240C 0.213 KΩ
5C 267.464 KΩ 125C 2.700 KΩ 245C 0.195 KΩ
10C 207.445 KΩ 130C 2.350 KΩ 250C 0.179 KΩ
15C 161.703 KΩ 135C 2.052 KΩ
20C 126.771 KΩ 140C 1.797 KΩ
25C 100.000 KΩ 145C 1.579 KΩ
30C 79.390KΩ 150C 1.392 KΩ
35C 63.439 KΩ 155C 1.230 KΩ
40C 51.021 KΩ 160C 1.090 KΩ
45C 41.295 KΩ 165C 0.968 KΩ
50C 33.628 KΩ 170C 0.862 KΩ
55C 27.547 KΩ 175C 0.770 KΩ
60C 22.693 KΩ 180C 0.689 KΩ
65C 18.794 KΩ 185C 0.619 KΩ
70C 15.644 KΩ 190C 0.557 KΩ
75C 13.084 KΩ 195C 0.502 KΩ

Axial Leaded Glass Encapsulated NTC Thermistor Mechanical Test

Test Standard Test Conditions and methods Requirements
Soldering & Solderability IEC60068-2-20
Test Ta
Temperature: 230±5 ℃,
2-2.5mm away from ceramic body
On: 2±0.5 Seconds.
The terminations shall be evenly tinned
Resistant to soldering heat IEC60068-2-20
Test Tb
Temperature: 260±5℃,
2-2.5mm away from ceramic body
On:10±1 Seconds.
No visible damage,
Lead wire tensile IEC60068-2-21
Test U
Test Ua: Force 10N, On 10 Seconds;
Test Ub: Bending 90C, Force 5N, Twice.
No break off,

Axial Leaded Glass Encapsulated NTC Thermistor Reliability Data

Test Standard Test Conditions ΔR25/R25 (typical) Remarks
Low temperature storage IEC 60068-2-1 Storage at low category
temperature: -30 oC,
Time: 1000 hours
≤3% No visible damage
Storage in dry heat IEC 60068-2-2 Storage at upper category temperature: 200 oC,
Time: 1000 hours
≤3% No visible damage
Storage in damp heat, steady state (Humidity test) IEC 60068-2-3 Temperature: 40oC,
Humidity:90%-95% RH,
Duration:1000 hours
≤3% No visible damage
Temperature cycling IEC 60068-2-14 1. -30C/30 minutes
2. 80C/5 minutes
3. 200C/30 minutes
4. 80C/5 minutes.
Number of cycles: 5 Cycles
≤3% No visible damage

Axial Lead Glass Sealed NTC Thermistor Application Precaution

Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.

Mounting and Handling Recommendations

Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:

  • No perpendicular forces must be applied to the body
  • During bending, the leads must be supported
  • Bending close to the body must be done very carefully
  • Axial forces to the body can influence the accuracy of the sensor and should be avoided
  • These sensors can be mounted on a minimum pitch of >5 mm

Soldering and Welding

  • Avoid any force on the body or leads during, or just after, soldering.
  • Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
  • Prevent fast cooling after soldering.
  • For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
  • For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
  • soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
  • The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor. 

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