Axial Leaded Glass Encapsulated Diode DO35 Shape NTC Thermistor Temperature Sensor, 47K Ohm, Beta B(25/50): 3950K, Operating Temperature Range -40C to +250C.

AMWEI Product Code: AMF58-473G3950

Appearance Dimension 

Axial Glass NTC Thermistor Temperature Sensor Dimension

Unit: mm

  • NTC Thermistor chip hermetically sealed in DO35 glass shell.
  • Tinned Dumet wire

Axial Glass NTC Thermistor Application

Axial lead glass encapsulated NTC thermistor used for high temperature measurement, sensing, monitoring, detection and control. Typical application such as  industrial process control, HVAC, oven,  office equipment, etc.

AMWEI Axial Glass Encapsulated NTC Thermistor Electric Characteristics Data

  • Resistance at 25C R25: 47K ohm+/-2%
  • Beta Value B(25/50): 3950K+/-1%
  • Optional R25 resistance tolerance,  ±1%(F), ±2%(G), ±3%(H), or ±5%(J)
  • Dissipation Factor:  δ≥2mW/℃
  • Thermal Time Constant (in still air): 12 seconds max.
  • Rated Power: ≤50mW
  • Insulation resistance: room temperature, 50VDC, 60 Seconds, ≥100MΩ.
  • Operating temperature range: -40 to +250C.

NTC 47K Ohm 3950K Resistance vs. Temperature RT Data

(K Ohm)
(K Ohm )
(K Ohm)
-40C 1465.6KΩ 80C 5.833 KΩ 200C 0.2792 KΩ
-35C 1066.1 KΩ 85C 4.948 KΩ 205C 0.2565 KΩ
-30C 783.6 KΩ 90C 4.220 KΩ 210C 0.2345 KΩ
-25C 582.0 KΩ 95C 3.610KΩ 215C 0.2144 KΩ
-20C 436.8 KΩ 100C 3.098 KΩ 220C 0.1960 KΩ
-15C 331.3  KΩ 105C 2.693 KΩ 225C 0.1792 KΩ
-10C 253.3 KΩ 110C 2.338 KΩ 230C 0.1648 KΩ
-5C 195.0 KΩ 115C 2.030 KΩ 235C 0.1514 KΩ
0C 151.1 KΩ 120C 1.765KΩ 240C 0.1391 KΩ
5C 118.4 KΩ 125C 1.538 KΩ 245C 0.1275 KΩ
10C 93.18 KΩ 130C 1.350KΩ 250C 0.1166 KΩ
15C 73.75 KΩ 135C 1.187 KΩ
20C 58.70 KΩ 140C 1.046 KΩ
25C 47.00 KΩ 145C 0.9219 KΩ
30C 37.85KΩ 150C 0.8128 KΩ
35C 30.66 KΩ 155C 0.7316 KΩ
40C 24.98KΩ 160C 0.6557 KΩ
45C 20.47 KΩ 165C 0.5864 KΩ
50C 16.86 KΩ 170C 0.5241 KΩ
55C 14.02 KΩ 175C 0.4688 KΩ
60C 11.69 KΩ 180C 0.4227 KΩ
65C 9.773 KΩ 185C 0.3815 KΩ
70C 8.200 KΩ 190C 0.3441 KΩ
75C 6.903 KΩ 195C 0.3102 KΩ

Axial Leaded Glass Encapsulated NTC Thermistor Mechanical Test

Test Standard Test Conditions and methods Requirements
Soldering & Solderability IEC60068-2-20
Test Ta
Temperature: 230±5 ℃,
2-2.5mm away from ceramic body
On: 2±0.5 Seconds.
The terminations shall be evenly tinned
Resistant to soldering heat IEC60068-2-20
Test Tb
Temperature: 260±5℃,
2-2.5mm away from ceramic body
On:10±1 Seconds.
No visible damage,
Lead wire tensile IEC60068-2-21
Test U
Test Ua: Force 10N, On 10 Seconds;
Test Ub: Bending 90C, Force 5N, Twice.
No break off,

Axial Leaded Glass Encapsulated NTC Thermistor Reliability Data

Test Standard Test Conditions ΔR25/R25 (typical) Remarks
Low temperature storage IEC 60068-2-1 Storage at low category
temperature: -30 oC,
Time: 1000 hours
≤3% No visible damage
Storage in dry heat IEC 60068-2-2 Storage at upper category temperature: 200 oC,
Time: 1000 hours
≤3% No visible damage
Storage in damp heat, steady state (Humidity test) IEC 60068-2-3 Temperature: 40oC,
Humidity:90%-95% RH,
Duration:1000 hours
≤3% No visible damage
Temperature cycling IEC 60068-2-14 1. -30C/30 minutes
2. 80C/5 minutes
3. 200C/30 minutes
4. 80C/5 minutes.
Number of cycles: 5 Cycles
≤3% No visible damage

Axial Lead Glass Sealed NTC Thermistor Application Precaution

Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.

Mounting and Handling Recommendations

Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:

  • No perpendicular forces must be applied to the body
  • During bending, the leads must be supported
  • Bending close to the body must be done very carefully
  • Axial forces to the body can influence the accuracy of the sensor and should be avoided
  • These sensors can be mounted on a minimum pitch of >5 mm

Soldering and Welding

  • Avoid any force on the body or leads during, or just after, soldering.
  • Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
  • Prevent fast cooling after soldering.
  • For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
  • For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
  • soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
  • The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor. 

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