Silicon Temp Sensor 1K RT Resistance vs. Temperature Characteristics Temperature (Centigrade C)
- High accuracy and reliability
- Long-term stability
- Positive temperature coefficient;
- Virtually linear characteristics
Resistance at 25C: 990–1010Ω
Dissipation Factor：1.5mW/C min. in still air
Thermal Time Constant： 21 seconds max. in still air
Insulation Resistance： 100MΩ (DC=100V)
Maximum operating current： 8mA max.
Rated operating current 2mA
Rated Power： 50mW max.
Temperature measurement range: -55C~+150C
Storage time 2 Years (Room temperature, relative humidity <60%)
Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.
Mounting and Handling Recommendations
Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:
- No perpendicular forces must be applied to the body
- During bending, the leads must be supported
- Bending close to the body must be done very carefully
- Axial forces to the body can influence the accuracy of the sensor and should be avoided
- These sensors can be mounted on a minimum pitch of >5 mm
Soldering and Welding
- Avoid any force on the body or leads during, or just after, soldering.
- Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
- Prevent fast cooling after soldering.
- For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
- For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
- soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
- The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor.