Axial Leaded Glass Encapsulated Diode DO35 Shape NTC Thermistor Temperature Sensor, 10K Ohm, Beta B(25/85): 3435K, Operating Temperature Range -40C to +250C.

AMWEI Product Code: AMF58-103F3435

Appearance Dimension 

Axial Glass NTC Thermistor Temperature Sensor Dimension

Unit: mm

  • NTC Thermistor chip hermetically sealed in DO35 glass shell.
  • Tinned Dumet wire

Axial Glass NTC Thermistor Application

Axial lead glass encapsulated NTC thermistor used for high temperature measurement, sensing, monitoring, detection and control. Typical application such as  industrial process control, HVAC, oven,  office equipment, etc.

AMWEI Axial Lead Glass Sealed NTC Thermistor Electric Characteristics Data

  • Resistance at 25C R25: 10K ohm+/-1%
  • Beta Value B(25/85): 3435K+/-1%
  • Optional R25 resistance tolerance,  ±1%(F), ±2%(G), ±3%(H), or ±5%(J)
  • Dissipation Factor:  δ≥2mW/℃
  • Thermal Time Constant (in still air): 12 seconds max.
  • Rated Power: ≤50mW
  • Insulation resistance: room temperature, 50VDC, 60 Seconds, ≥100MΩ.
  • Operating temperature range: -40 to +250C.

NTC 10K Ohm 3435K Resistance vs. Temperature RT Data

(K Ohm)
(K Ohm )
(K Ohm)
-30C 118.718  KΩ 80C 1.676 KΩ 190C 0.139 KΩ
-25C 91.374  KΩ 85C 1.458 KΩ 195C 0.126 KΩ
-20C 70.876 KΩ 90C 1.272 KΩ 200C 0.115 KΩ
-15C 55.400 KΩ 95C 1.114 KΩ 205C 0.105 KΩ
-10C 43.633 KΩ 100C 0.978 KΩ 210C 0.096 KΩ
-5C 34.622 KΩ 105C 0.861 KΩ 215C 0.088 KΩ
0C 27.672 KΩ 110C 0.761 KΩ 220C 0.081 KΩ
5C 22.275 KΩ 115C 0.674 KΩ 225C 0.074 KΩ
10C 18.054 KΩ 120C 0.598 KΩ  230C 0.068 KΩ
15C 14.732 KΩ 125C 0.533 KΩ 235C 0.063 KΩ
20C 12.100 KΩ 130C 0.475 KΩ 240C 0.058 KΩ
25C 10.000 KΩ 135C 0.426 KΩ 245C 0.053 KΩ
30C 8.293 KΩ 140C 0.382 KΩ 250C 0.049 KΩ
35C 6.921 KΩ 145C 0.344 KΩ
40C 5.809 KΩ 150C 0.310 KΩ
45C 4.901 KΩ 155C 0.279 KΩ
50C 4.155 KΩ 160C 0.251 KΩ
55C 3.538 KΩ 165C 0.226 KΩ
60C 3.025 KΩ 170C 0.205 KΩ
65C 2.596 KΩ 175C 0.185 KΩ
70C 2.236 KΩ 180C 0.168 KΩ
75C 1.932 KΩ 185C 0.152 KΩ

Axial Leaded Glass Encapsulated NTC Thermistor Mechanical Test

Test Standard Test Conditions and methods Requirements
Soldering & Solderability IEC60068-2-20
Test Ta
Temperature: 230±5 ℃,
2-2.5mm away from ceramic body
On: 2±0.5 Seconds.
The terminations shall be evenly tinned
Resistant to soldering heat IEC60068-2-20
Test Tb
Temperature: 260±5℃,
2-2.5mm away from ceramic body
On:10±1 Seconds.
No visible damage,
Lead wire tensile IEC60068-2-21
Test U
Test Ua: Force 10N, On 10 Seconds;
Test Ub: Bending 90C, Force 5N, Twice.
No break off,

Axial Leaded Glass Encapsulated NTC Thermistor Reliability Data

Test Standard Test Conditions ΔR25/R25 (typical) Remarks
Low temperature storage IEC 60068-2-1 Storage at low category
temperature: -30 oC,
Time: 1000 hours
≤3% No visible damage
Storage in dry heat IEC 60068-2-2 Storage at upper category temperature: 200 oC,
Time: 1000 hours
≤3% No visible damage
Storage in damp heat, steady state (Humidity test) IEC 60068-2-3 Temperature: 40oC,
Humidity:90%-95% RH,
Duration:1000 hours
≤3% No visible damage
Temperature cycling IEC 60068-2-14 1. -30C/30 minutes
2. 80C/5 minutes
3. 200C/30 minutes
4. 80C/5 minutes.
Number of cycles: 5 Cycles
≤3% No visible damage

Axial Lead Glass Sealed NTC Thermistor Application Precaution

Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.

Mounting and Handling Recommendations

Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:

  • No perpendicular forces must be applied to the body
  • During bending, the leads must be supported
  • Bending close to the body must be done very carefully
  • Axial forces to the body can influence the accuracy of the sensor and should be avoided
  • These sensors can be mounted on a minimum pitch of >5 mm

Soldering and Welding

  • Avoid any force on the body or leads during, or just after, soldering.
  • Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
  • Prevent fast cooling after soldering.
  • For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
  • For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
  • soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
  • The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor. 

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