Axial Leaded Glass Encapsulated Diode DO35 Shape NTC Thermistor Temperature Sensor, 10K Ohm, Beta B(25/50): 3950K, Operating Temperature Range -40C to +250C.

AMWEI Product Code: AMF58-103F3950

Appearance Dimension 

Axial Glass NTC Thermistor Temperature Sensor Dimension

Unit: mm

  • NTC Thermistor chip hermetically sealed in DO35 glass shell.
  • Tinned Dumet wire

Axial Glass NTC Thermistor Application

Axial lead glass encapsulated NTC thermistor used for high temperature measurement, sensing, monitoring, detection and control. Typical application such as  industrial process control, HVAC, oven,  office equipment, etc.

AMWEI Axial Glass Encapsulated NTC Thermistor Electric Characteristics Data

  • Resistance at 25C R25: 10K ohm+/-1%
  • Beta Value B(25/50): 3950K+/-1%
  • Optional R25 resistance tolerance,  ±1%(F), ±2%(G), ±3%(H), or ±5%(J)
  • Dissipation Factor:  δ≥2mW/℃
  • Thermal Time Constant (in still air): 12 seconds max.
  • Rated Power: ≤50mW
  • Insulation resistance: room temperature, 50VDC, 60 Seconds, ≥100MΩ.
  • Operating temperature range: -40 to +250C.

NTC 10K Ohm 3950K Resistance vs. Temperature RT Data

(K Ohm)
(K Ohm )
(K Ohm)
-40C 285.900 KΩ 80C 1.256 KΩ 200C 0.070 KΩ
-35C 210.375 KΩ 85C 1.072 KΩ 205C 0.064 KΩ
-30C 157.411 KΩ 90C 0.918 KΩ 210C 0.058 KΩ
-25C 119.121 KΩ 95C 0.789 KΩ 215C 0.053 KΩ
-20C 90.852 KΩ 100C 0.681 KΩ 220C 0.049 KΩ
-15C 69.687 KΩ 105C 0.588 KΩ 225C 0.045 KΩ
-10C 53.700 KΩ 110C 0.511 KΩ 230C 0.041 KΩ
-5C 41.555 KΩ 115C 0.445 KΩ 235C 0.038 KΩ
0C 32.298 KΩ 120C 0.389 KΩ 240C 0.035 KΩ
5C 25.283 KΩ 125C 0.341 KΩ 245C 0.032 KΩ
10C 19.884 KΩ 130C 0.300KΩ 250C 0.030 KΩ
15C 15.721 KΩ 135C 0.266KΩ
20C 12.501 KΩ 140C 0.235 KΩ
25C 10.000 KΩ 145C 0.209 KΩ
30C 8.049 KΩ 150C 0.187 KΩ
35C 6.518 KΩ 155C 0.167 KΩ
40C 5.311 KΩ 160C 0.150 KΩ
45C 4.353 KΩ 165C 0.135 KΩ
50C 3.588 KΩ 170C 0.122 KΩ
55C 2.975 KΩ 175C 0.111 KΩ
60C 2.479 KΩ 180C 0.101 KΩ
65C 2.077 KΩ 185C 0.092 KΩ
70C 1.748 KΩ 190C 0.084 KΩ
75C 1.479 KΩ 195C 0.076 KΩ

Axial Leaded Glass Encapsulated NTC Thermistor Mechanical Test

Test Standard Test Conditions and methods Requirements
Soldering & Solderability IEC60068-2-20
Test Ta
Temperature: 230±5 ℃,
2-2.5mm away from ceramic body
On: 2±0.5 Seconds.
The terminations shall be evenly tinned
Resistant to soldering heat IEC60068-2-20
Test Tb
Temperature: 260±5℃,
2-2.5mm away from ceramic body
On:10±1 Seconds.
No visible damage,
Lead wire tensile IEC60068-2-21
Test U
Test Ua: Force 10N, On 10 Seconds;
Test Ub: Bending 90C, Force 5N, Twice.
No break off,

Axial Leaded Glass Encapsulated NTC Thermistor Reliability Data

Test Standard Test Conditions ΔR25/R25 (typical) Remarks
Low temperature storage IEC 60068-2-1 Storage at low category
temperature: -30 oC,
Time: 1000 hours
≤3% No visible damage
Storage in dry heat IEC 60068-2-2 Storage at upper category temperature: 200 oC,
Time: 1000 hours
≤3% No visible damage
Storage in damp heat, steady state (Humidity test) IEC 60068-2-3 Temperature: 40oC,
Humidity:90%-95% RH,
Duration:1000 hours
≤3% No visible damage
Temperature cycling IEC 60068-2-14 1. -30C/30 minutes
2. 80C/5 minutes
3. 200C/30 minutes
4. 80C/5 minutes.
Number of cycles: 5 Cycles
≤3% No visible damage

Axial Lead Glass Sealed NTC Thermistor Application Precaution

Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.

Mounting and Handling Recommendations

Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:

  • No perpendicular forces must be applied to the body
  • During bending, the leads must be supported
  • Bending close to the body must be done very carefully
  • Axial forces to the body can influence the accuracy of the sensor and should be avoided
  • These sensors can be mounted on a minimum pitch of >5 mm

Soldering and Welding

  • Avoid any force on the body or leads during, or just after, soldering.
  • Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
  • Prevent fast cooling after soldering.
  • For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
  • For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
  • soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
  • The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor. 

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