Axial Leaded Glass Encapsulated Diode DO35 Shape NTC Thermistor Temperature Sensor, 100K Ohm, Beta B(25/50): 4200K, Operating Temperature Range -40C to +250C.
Unit: mm
- NTC Thermistor chip hermetically sealed in DO35 glass shell.
- Tinned Dumet wire
Axial lead glass encapsulated NTC thermistor used for high temperature measurement, sensing, monitoring, detection and control. Typical application such as industrial process control, HVAC, oven, office equipment, etc.
- Resistance at 25C R25: 100K ohm+/-2%
- Beta Value B(25/50): 4200K+/-1%
- Optional R25 resistance tolerance, ±1%(F), ±2%(G), ±3%(H), or ±5%(J)
- Dissipation Factor: δ≥2mW/℃
- Thermal Time Constant (in still air): 12 seconds max.
- Rated Power: ≤50mW
- Insulation resistance: room temperature, 50VDC, 60 Seconds, ≥100MΩ.
- Operating temperature range: -40 to +250C.
Temperature Centigrade |
Resistance (K Ohm) |
Temperature Centigrade |
Resistance (K Ohm ) |
Temperature Centigrade |
Resistance (K Ohm) |
---|---|---|---|---|---|
-40C | 4124.951 KΩ | 80C | 10.991 KΩ | 200C | 0.453 KΩ |
-35C | 2890.803 KΩ | 85C | 9.271 KΩ | 205C | 0.410 KΩ |
-30C | 2053.500 KΩ | 90C | 7.850 KΩ | 210C | 0.371 KΩ |
-25C | 1479.195 KΩ | 95C | 6.671 KΩ | 215C | 0.337 KΩ |
-20C | 1080.200 KΩ | 100C | 5.688 KΩ | 220C | 0.306 KΩ |
-15C | 799.157 KΩ | 105C | 4.865 KΩ | 225C | 0.279 KΩ |
-10C | 598.392 KΩ | 110C | 4.177 KΩ | 230C | 0.255 KΩ |
-5C | 452.969 KΩ | 115C | 3.599 KΩ | 235C | 0.233 KΩ |
0C | 346.214 KΩ | 120C | 3.112 KΩ | 240C | 0.213 KΩ |
5C | 267.464 KΩ | 125C | 2.700 KΩ | 245C | 0.195 KΩ |
10C | 207.445 KΩ | 130C | 2.350 KΩ | 250C | 0.179 KΩ |
15C | 161.703 KΩ | 135C | 2.052 KΩ | ||
20C | 126.771 KΩ | 140C | 1.797 KΩ | ||
25C | 100.000 KΩ | 145C | 1.579 KΩ | ||
30C | 79.390KΩ | 150C | 1.392 KΩ | ||
35C | 63.439 KΩ | 155C | 1.230 KΩ | ||
40C | 51.021 KΩ | 160C | 1.090 KΩ | ||
45C | 41.295 KΩ | 165C | 0.968 KΩ | ||
50C | 33.628 KΩ | 170C | 0.862 KΩ | ||
55C | 27.547 KΩ | 175C | 0.770 KΩ | ||
60C | 22.693 KΩ | 180C | 0.689 KΩ | ||
65C | 18.794 KΩ | 185C | 0.619 KΩ | ||
70C | 15.644 KΩ | 190C | 0.557 KΩ | ||
75C | 13.084 KΩ | 195C | 0.502 KΩ |
Test | Standard | Test Conditions and methods | Requirements |
---|---|---|---|
Soldering & Solderability | IEC60068-2-20 Test Ta |
Temperature: 230±5 ℃, 2-2.5mm away from ceramic body On: 2±0.5 Seconds. |
The terminations shall be evenly tinned |
Resistant to soldering heat | IEC60068-2-20 Test Tb |
Temperature: 260±5℃, 2-2.5mm away from ceramic body On:10±1 Seconds. |
No visible damage, ΔR25/R25≤3% |
Lead wire tensile | IEC60068-2-21 Test U |
Test Ua: Force 10N, On 10 Seconds; Test Ub: Bending 90C, Force 5N, Twice. |
No break off, ΔR25/R25≤3% |
Test | Standard | Test Conditions | ΔR25/R25 (typical) | Remarks |
---|---|---|---|---|
Low temperature storage | IEC 60068-2-1 | Storage at low category temperature: -30 oC, Time: 1000 hours |
≤3% | No visible damage |
Storage in dry heat | IEC 60068-2-2 | Storage at upper category temperature: 200 oC, Time: 1000 hours |
≤3% | No visible damage |
Storage in damp heat, steady state (Humidity test) | IEC 60068-2-3 | Temperature: 40oC, Humidity:90%-95% RH, Duration:1000 hours |
≤3% | No visible damage |
Temperature cycling | IEC 60068-2-14 | 1. -30C/30 minutes 2. 80C/5 minutes 3. 200C/30 minutes 4. 80C/5 minutes. Number of cycles: 5 Cycles |
≤3% | No visible damage |
Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.
Mounting and Handling Recommendations
Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:
- No perpendicular forces must be applied to the body
- During bending, the leads must be supported
- Bending close to the body must be done very carefully
- Axial forces to the body can influence the accuracy of the sensor and should be avoided
- These sensors can be mounted on a minimum pitch of >5 mm
Soldering and Welding
- Avoid any force on the body or leads during, or just after, soldering.
- Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
- Prevent fast cooling after soldering.
- For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
- For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
- soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
- The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor.
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