Axial Leaded Glass Encapsulated Diode DO35 Shape NTC Thermistor Temperature Sensor, 20K Ohm, Beta B(25/50): 3950K, Operating Temperature Range -40C to +250C.
Unit: mm
- NTC Thermistor chip hermetically sealed in DO35 glass shell.
- Tinned Dumet wire
Axial lead glass encapsulated NTC thermistor used for high temperature measurement, sensing, monitoring, detection and control. Typical application such as industrial process control, HVAC, oven, office equipment, etc.
- Resistance at 25C R25: 20K ohm+/-2%
- Beta Value B(25/50): 3950K+/-1%
- Optional R25 resistance tolerance, ±1%(F), ±2%(G), ±3%(H), or ±5%(J)
- Dissipation Factor: δ≥2mW/℃
- Thermal Time Constant (in still air): 12 seconds max.
- Rated Power: ≤50mW
- Insulation resistance: room temperature, 50VDC, 60 Seconds, ≥100MΩ.
- Operating temperature range: -40 to +250C.
| Temperature Centigrade |
Resistance (K Ohm) |
Temperature Centigrade |
Resistance (K Ohm ) |
Temperature Centigrade |
Resistance (K Ohm) |
|---|---|---|---|---|---|
| -40C | 699.295 KΩ | 80C | 2.526 KΩ | 200C | 0.135 KΩ |
| -35C | 497.852 KΩ | 85C | 2.155 KΩ | 205C | 0.123 KΩ |
| -30C | 359.261 KΩ | 90C | 1.846 KΩ | 210C | 0.113 KΩ |
| -25C | 262.710 KΩ | 95C | 1.587 KΩ | 215C | 0.103 KΩ |
| -20C | 194.541 KΩ | 100C | 1.369 KΩ | 220C | 0.095 KΩ |
| -15C | 145.760 KΩ | 105C | 1.186 KΩ | 225C | 0.087 KΩ |
| -10C | 110.396 KΩ | 110C | 1.030 KΩ | 230C | 0.080 KΩ |
| -5C | 84.443 KΩ | 115C | 0.898 KΩ | 235C | 0.074 KΩ |
| 0C | 65.179 KΩ | 120C | 0.785 KΩ | 240C | 0.068 KΩ |
| 5C | 50.728 KΩ | 125C | 0.688 KΩ | 245C | 0.063 KΩ |
| 10C | 39.786 KΩ | 130C | 0.606 KΩ | 250C | 0.058 KΩ |
| 15C | 31.427 KΩ | 135C | 0.534 KΩ | ||
| 20C | 24.991 KΩ | 140C | 0.473 KΩ | ||
| 25C | 20.000 KΩ | 145C | 0.420 KΩ | ||
| 30C | 16.104 KΩ | 150C | 0.373 KΩ | ||
| 35C | 13.044 KΩ | 155C | 0.334 KΩ | ||
| 40C | 10.627 KΩ | 160C | 0.299 KΩ | ||
| 45C | 8.708 KΩ | 165C | 0.269 KΩ | ||
| 50C | 7.176 KΩ | 170C | 0.242 KΩ | ||
| 55C | 5.957 KΩ | 175C | 0.219 KΩ | ||
| 60C | 4.971 KΩ | 180C | 0.198 KΩ | ||
| 65C | 4.169 KΩ | 185C | 0.179 KΩ | ||
| 70C | 3.513 KΩ | 190C | 0.163 KΩ | ||
| 75C | 2.973 KΩ | 195C | 0.148 KΩ |
| Test | Standard | Test Conditions and methods | Requirements |
|---|---|---|---|
| Soldering & Solderability | IEC60068-2-20 Test Ta |
Temperature: 230±5 ℃， 2-2.5mm away from ceramic body On: 2±0.5 Seconds. |
The terminations shall be evenly tinned |
| Resistant to soldering heat | IEC60068-2-20 Test Tb |
Temperature: 260±5℃, 2-2.5mm away from ceramic body On：10±1 Seconds. |
No visible damage, ΔR25/R25≤3% |
| Lead wire tensile | IEC60068-2-21 Test U |
Test Ua: Force 10N, On 10 Seconds; Test Ub: Bending 90C, Force 5N, Twice. |
No break off, ΔR25/R25≤3% |
| Test | Standard | Test Conditions | ΔR25/R25 (typical) | Remarks |
|---|---|---|---|---|
| Low temperature storage | IEC 60068-2-1 | Storage at low category temperature: -30 oC, Time: 1000 hours |
≤3% | No visible damage |
| Storage in dry heat | IEC 60068-2-2 | Storage at upper category temperature: 200 oC, Time: 1000 hours |
≤3% | No visible damage |
| Storage in damp heat, steady state (Humidity test) | IEC 60068-2-3 | Temperature: 40oC, Humidity:90%-95% RH, Duration:1000 hours |
≤3% | No visible damage |
| Temperature cycling | IEC 60068-2-14 | 1. -30C/30 minutes 2. 80C/5 minutes 3. 200C/30 minutes 4. 80C/5 minutes. Number of cycles: 5 Cycles |
≤3% | No visible damage |
Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.
Mounting and Handling Recommendations
Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:
- No perpendicular forces must be applied to the body
- During bending, the leads must be supported
- Bending close to the body must be done very carefully
- Axial forces to the body can influence the accuracy of the sensor and should be avoided
- These sensors can be mounted on a minimum pitch of >5 mm
Soldering and Welding
- Avoid any force on the body or leads during, or just after, soldering.
- Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
- Prevent fast cooling after soldering.
- For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
- For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
- soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
- The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor.
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