Axial Leaded Glass Encapsulated Diode DO35 Shape NTC Thermistor Temperature Sensor, 50K Ohm, Beta B(25/50): 4050K, Operating Temperature Range -40C to +250C.
Unit: mm
- NTC Thermistor chip hermetically sealed in DO35 glass shell.
- Tinned Dumet wire
Axial lead glass encapsulated NTC thermistor used for high temperature measurement, sensing, monitoring, detection and control. Typical application such as industrial process control, HVAC, oven, office equipment, etc.
- Resistance at 25C R25: 50K ohm+/-2%
- Beta Value B(25/50): 4050K+/-1%
- Optional R25 resistance tolerance, ±1%(F), ±2%(G), ±3%(H), or ±5%(J)
- Dissipation Factor: δ≥2mW/℃
- Thermal Time Constant (in still air): 12 seconds max.
- Rated Power: ≤50mW
- Insulation resistance: room temperature, 50VDC, 60 Seconds, ≥100MΩ.
- Operating temperature range: -40 to +250C.
| Temperature Centigrade |
Resistance (K Ohm) |
Temperature Centigrade |
Resistance (K Ohm ) |
Temperature Centigrade |
Resistance (K Ohm) |
|---|---|---|---|---|---|
| -40C | 1827.900 KΩ | 80C | 5.968 KΩ | 200C | 0.283 KΩ |
| -35C | 1297.099 KΩ | 85C | 5.066 KΩ | 205C | 0.257 KΩ |
| -30C | 933.679 KΩ | 90C | 4.183 KΩ | 210C | 0.234 KΩ |
| -25C | 681.053 KΩ | 95C | 3.693 KΩ | 215C | 0.213 KΩ |
| -20C | 502.912 KΩ | 100C | 3.170 KΩ | 220C | 0.195 KΩ |
| -15C | 375.600 KΩ | 105C | 2.731 KΩ | 225C | 0.178 KΩ |
| -10C | 283.469 KΩ | 110C | 2.360 KΩ | 230C | 0.163 KΩ |
| -5C | 216.016 KΩ | 115C | 2.047 KΩ | 235C | 0.149 KΩ |
| 0C | 166.093 KΩ | 120C | 1.781 KΩ | 240C | 0.137 KΩ |
| 5C | 128.771 KΩ | 125C | 1.554 KΩ | 245C | 0.126 KΩ |
| 10C | 100.608 KΩ | 130C | 1.360 KΩ | 250C | 0.116 KΩ |
| 15C | 79.170 KΩ | 135C | 1.194 KΩ | ||
| 20C | 62.719 KΩ | 140C | 1.052 KΩ | ||
| 25C | 50.000 KΩ | 145C | 0.929 KΩ | ||
| 30C | 40.096KΩ | 150C | 0.822 KΩ | ||
| 35C | 32.334 KΩ | 155C | 0.732 KΩ | ||
| 40C | 26.212 KΩ | 160C | 0.653 KΩ | ||
| 45C | 21.355 KΩ | 165C | 0.584 KΩ | ||
| 50C | 17.481 KΩ | 170C | 0.523 KΩ | ||
| 55C | 14.438 KΩ | 175C | 0.470 KΩ | ||
| 60C | 11.987 KΩ | 180C | 0.423 KΩ | ||
| 65C | 10.001 KΩ | 185C | 0.381 KΩ | ||
| 70C | 8.384 KΩ | 190C | 0.345 KΩ | ||
| 75C | 7.058 KΩ | 195C | 0.312 KΩ |
| Test | Standard | Test Conditions and methods | Requirements |
|---|---|---|---|
| Soldering & Solderability | IEC60068-2-20 Test Ta |
Temperature: 230±5 ℃， 2-2.5mm away from ceramic body On: 2±0.5 Seconds. |
The terminations shall be evenly tinned |
| Resistant to soldering heat | IEC60068-2-20 Test Tb |
Temperature: 260±5℃, 2-2.5mm away from ceramic body On：10±1 Seconds. |
No visible damage, ΔR25/R25≤3% |
| Lead wire tensile | IEC60068-2-21 Test U |
Test Ua: Force 10N, On 10 Seconds; Test Ub: Bending 90C, Force 5N, Twice. |
No break off, ΔR25/R25≤3% |
| Test | Standard | Test Conditions | ΔR25/R25 (typical) | Remarks |
|---|---|---|---|---|
| Low temperature storage | IEC 60068-2-1 | Storage at low category temperature: -30 oC, Time: 1000 hours |
≤3% | No visible damage |
| Storage in dry heat | IEC 60068-2-2 | Storage at upper category temperature: 200 oC, Time: 1000 hours |
≤3% | No visible damage |
| Storage in damp heat, steady state (Humidity test) | IEC 60068-2-3 | Temperature: 40oC, Humidity:90%-95% RH, Duration:1000 hours |
≤3% | No visible damage |
| Temperature cycling | IEC 60068-2-14 | 1. -30C/30 minutes 2. 80C/5 minutes 3. 200C/30 minutes 4. 80C/5 minutes. Number of cycles: 5 Cycles |
≤3% | No visible damage |
Minimum lead wire length tailored to shall be ≥8mm.
In lead wire bending, bending point shall be more than 2mm away from glass body part.
Mounting and Handling Recommendations
Excessive forces applied to a sensor may cause serious damage. To avoid this, the following recommendations should be adhered to:
- No perpendicular forces must be applied to the body
- During bending, the leads must be supported
- Bending close to the body must be done very carefully
- Axial forces to the body can influence the accuracy of the sensor and should be avoided
- These sensors can be mounted on a minimum pitch of >5 mm
Soldering and Welding
- Avoid any force on the body or leads during, or just after, soldering.
- Do not correct the position of an already soldered sensor by pushing, pulling or twisting the body.
- Prevent fast cooling after soldering.
- For hand soldering, where mounting is not on a printed-circuit board, the soldering temperature should be <300C the soldering time <3 s and the distance between body and soldering point >1.5 mm.
- For hand soldering, dip, wave or other bath soldering, mounted on a printed-circuit board, the
- soldering temperature should be <300C, the soldering time <5 s and the distance between body and soldering point >1.5 mm.
- The distance between the body and the welding point should be >0.5 mm. Care should be taken to ensure that welding current never passes through the sensor.
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